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GTM501 HSPA Broadband Wireless Module a Winner at GSMA's Embedded Mobile Module Competition

11/18/09 - Option announced that its GTM501, the world's smallest HSPA module and one of Option's broadband wireless breakthroughs, has been selected as the winner of the GSMA's Embedded Mobile Module competition in the 'Best Embedded Module in the High-Bandwidth Application' category. The announcement was made today at the GSMA Mobile Asia Congress in Hong-Kong. This award validates the market leading technology that makes the GTM501 the ideal 3G solution for new generation Internet devices such as e-readers, small mobile computing devices and connected cameras.

"This award is clear evidence that Option designed, developed and brought to market a truly unique product that meets the requirements of device manufacturers seeking the best 3G solution for a wide range of thin mobile devices," said Jan Callewaert, CEO at Option. "The GTM501 is one of the cornerstones in our strategy to provide total 3G solutions - including high valued services, software and hardware - to innovative companies."

The GTM501 is the smallest and thinnest 3G HSPA module in the world (25mm x 30mm x 2.3mm). It has superior heat dissipation characteristics vital to designers of small connected devices and thanks to the state-of-the-art molding technique used it is one of the most solid and durable 3G modules on the market with excellent resistance to shock, vibration, extreme temperatures and humidity. On top of this, the module is shipping with market-leading download speeds up to 10.2Mbps. To support companies bringing to market innovative new products based on modules like the GTM501, Option provides a wide range of support services ranging from design guidance to help with certification.

Option is unique in bringing to the market such a broad solution for next generation Internet devices. Earlier this week Option announced that the GTM501 was selected by Plastic Logic for its newest eReader.

The Embedded Mobile competition is part of the GSMA's Embedded Mobile initiative, which was launched in November 2008 to foster new business opportunities by bringing the benefits of continuous mobile connectivity to embedded devices. The first stage of the competition, which focused on embedded modules, has now ended by announcing the winners in the low-bandwidth and high-bandwidth categories at the GSMA's Mobile Asia Congress. The second stage of the competition will focus on innovative service applications and solutions and the winners will be announced at the GSMA's Mobile World Congress in Barcelona in February 2010.

With this award, GSMA wishes to recognize the importance of this innovative new module in the market. In addition to its unique features and benefits, the GTM501's price competitiveness, time to market and ease of deployment made it a clear winner in its category.

By Robert Hoskins

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